Qualcomm
Follow-up Platform · Qualcomm Open Firmware
LeMans
IQ-9075 EVK
An automotive-class SoC — the same OP-TEE open-firmware build as Kodiak, with extra hardware security.
LeMans IQ-9075 · automotive-class
What it is
- OP-TEE open-firmware build for the Qualcomm IQ-9075 EVK
- Same manifest + build-system model as Kodiak
- Automotive-class SoC
Documentation
Full deep-dive and quick start:
Differences from Kodiak
| Aspect | Kodiak (QCM6490) | LeMans (IQ-9075) |
|---|---|---|
| First stage / signing | TF-A BL2 — single sign (sectools, TZ-TEE) | U-Boot SPL — double sign (SWIV + qtestsign) |
| Boot image | TF-A FIP (BL31+BL32+BL33) | SPL_LOAD_FIT boot FIT (BL31+OP-TEE+U-Boot) |
| Kernel DTB | embedded in the UKI (-el2) | embedded in the UKI (-el2) — same |
| U-Boot control DTB | multi-DTB FIT — board auto-detected from SMEM socinfo | appended DTB in the boot FIT |
| Boot sequence | XBL → BL2 → BL31 → OP-TEE → U-Boot → UKI | XBL → SPL → BL31 → OP-TEE → U-Boot → Linux |
Double signing: LeMans wraps the SPL in an inner
SWIV segment (swiv_build_utility.py), then signs the
result with qtestsign — two layers, vs Kodiak's single sectools signature.